Low Dielectric Constant Multilayer Glass-Ceramic Substrate with Ag-Pd Wiring for VLSI Package 适用于VLSI封装的用Ag-Pd布线的低介电常数多层玻璃&陶瓷基板
Current Condition of Build-up Multilayer Wiring Board in Application Market 积层多层板应用市场的现状
Advanced packaging technology represented by CSP and the development of build up-type multilayer printed wiring board ( PWB) that make such high-density packaging possible are making greatly progress. 以CSP为代表的先进封装技术和可以实现高密度封装的确积层多层板的开发已经取得了很大的进步。
Development of Resistive Pastes with Middle and High Resistivity Used for Multilayer Wiring Dielectric Surface 多层布线介质表面用中高阻电阻浆料的研制
Effects of conductive and glass phases as well as additives on surface resistivity, it's temperature coefficient ( TCR) and stability of multilayer wiring dielectric surface are researched and mechanism of resistance floatation due to interaction between dielectric and resistive layers is analyzed. 研究了导电相、玻璃相和添加剂对多层布线表面电阻的方阻、温度系数和稳定性的影响,分析了介质层与电阻层之间的相互作用而导致电阻阻值变化的机理。
CMP Study of Multilayer Wiring Conductor Copper in ULSI Manufacturing ULSI制备中多层布线导体铜的抛光液与抛光技术的研究
Integrated Package Technique of Multilayer Wiring on Silicon Based Board 硅基多层布线集成组装技术